GCS has developed high-Q, small-size passive IC elements for integration with GaAs PA and switch chips to further reduce cell phone front-end module size and cost. Large through-substrate vias are also available with IPD process.
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GCS has developed high-Q, small-size passive IC elements for integration with GaAs PA and switch chips to further reduce cell phone front-end module size and cost. Large through-substrate vias are also available with IPD process.
